Experimental Heat Transfer, Journal Year: 2025, Volume and Issue: unknown, P. 1 - 24
Published: Feb. 18, 2025
The present investigation introduces an innovative approach to improving the thermal performance of heat sinks for electronic cooling by using array various pin fin profiles – square, circular, triangular, and NACA 0040—arranged in stream wise direction between consecutive parallel plate fins. systematic comparison these profiles, combined with exploration a wide range parameters Reynolds numbers while maintaining consistent blockage area, constitutes novel enhancing sink performance. study examines such as pitch ratio (Px/Lhs) from 0.24 0.28 profile thickness (b/Sf) 0.3 0.5, span fixed at 11.9 mm. number (Re) varies 300 3300. CFD results show that 0040 outperforms other terms within specified range. Experimental validation yielded maximum thermo-hydraulic parameter (THPP) 1.41 Px/Lhs = 0.26 b/Sf 0.4, achieved 2700.
Language: Английский