Dynamic study of streamer interaction with fluidized particles in a plasma fluidized-bed system

Journal of Applied Physics, Journal Year: 2025, Volume and Issue: 137(13)

Published: April 1, 2025

Exploration of the interaction dynamics between plasma and fluidized particles in a fluidized-bed holds practical importance for elucidating mechanism treatment powders. In this study, we employed 2D fluid model to investigate effects particle diameter, dielectric constant, inter-particle spacing, with primary aim simulating specific consequences variations size, material type, gas-to-powder ratio (GPR) on powder processing effect. The results indicate that diameters below 300 μm exert less impact streamer propagation, enabling complete wrapping surface (100%). However, diameter 400 induce branching, leading reduction area 46%. These observations imply critical size range 300–400 achieving effective particles. Plasma ensures comprehensive coverage low constants (εr<4), while possessing higher constant (εr>8) exhibit diminished plasma-treated (80%), meaning longer durations high materials may be required achieve comparable Furthermore, as spacing increases from 10 500 μm, undergoes an initial increment, followed by subsequent reduction. Notably, at channel displays root-like branching pattern, substantial expansion area. This indicates optimal GPR system can enhance

Language: Английский

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Sample Thickness and Edge Proximity Influence Spatial Behavior of Filaments and Treatment Uniformity of RF Cold Atmospheric Pressure Plasma Jet

Plasma Chemistry and Plasma Processing, Journal Year: 2024, Volume and Issue: unknown

Published: Oct. 10, 2024

Abstract The ability of atmospheric pressure plasma jets to treat complex non-planar surfaces is often cited as their advantage over other plasmas. However, the effect on parameters and treatment efficiency has seldom been studied. Herein, we investigate interaction slit jet (PSJ) with block polypropylene samples different thicknesses (5 30 mm) moving at two speeds. Even though distance between outlet sample surface was kept constant, PSJ ignited in Ar $$\hbox {Ar/O}_2$$ Ar/O 2 gas feeds varied thickness due such filament count speed being affected by distances ground (the closer is, higher discharge electric field). On hand, {Ar/N}_2$$ Ar/N diffuse plumes were less changes field, same for both thicknesses. Additionally, observed a difference uniformity edges central areas some working conditions. near depended duration contact, i. e. , how long local field trapped filaments. Conversely, if number filaments changed rapidly moved off 5 mm treated easily sustained PSJ).

Language: Английский

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Research progress of low-temperature plasma polishing technology in chip material processing

Clean Energy Science and Technology, Journal Year: 2024, Volume and Issue: 2(4), P. 263 - 263

Published: Nov. 21, 2024

Low-temperature plasma polishing technology, by virtue of the plasma’s highly ionized characteristics, can accurately remove tiny defects and impurities on surface chip materials, improve flatness finish reduce mechanical damage subsurface damage, has a high material removal rate. This paper reviews application status, advantages limitations technologies in field processing. The principles applications plasma-assisted polishing, chemical vaporization machining, electrolytic processing-mechanical assisted selective etching are specifically discussed, their analyzed. Finally, development chip-polishing technology is prospected, aiming to provide useful reference for continuous improvement manufacturing processes future microelectronics industry.

Language: Английский

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低温等离子体抛光技术在芯片材料加工中的研究进展

清洁能源科学与技术, Journal Year: 2024, Volume and Issue: 2(4), P. 226 - 226

Published: Nov. 21, 2024

低温等离子体抛光技术利用其高度电离的特性，能够精确去除芯片材料表面的微小缺陷和杂质，提高芯片材料的平整度和光洁度，减少机械损伤和亚表面损伤，同时具有较高的材料去除率。本文综述了等离子体抛光技术在芯片材料加工领域的应用现状、优势及其局限性。具体探讨了等离子体辅助抛光（PAP）、等离子体化学气化加工（PCVM）、等离子体电解处理辅助抛光（PEP-MP）和等离子体选择刻蚀（PASE）等工艺技术的原理及应用，分析了其优势与局限性，最后对等离子体芯片抛光技术的发展进了展望，旨在为芯片制造工艺的持续改进和微电子产业的未来发展提供有益参考。

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Atmospheric pressure plasma jet for surface treatment: a review

Reviews of Modern Plasma Physics, Journal Year: 2024, Volume and Issue: 9(1)

Published: Dec. 28, 2024

Language: Английский

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