Fundamental Insights into Copper-Epoxy Interfaces for High-Frequency Chip-to-Chip Interconnects DOI
J.M. Park, Monsuru Olatunji Dauda, Mustapha Bello

et al.

ACS Applied Materials & Interfaces, Journal Year: 2024, Volume and Issue: 17(1), P. 2480 - 2490

Published: Dec. 18, 2024

Future processes and materials are needed to enable multichip packages with chip-to-chip (C2C) data rates of 50 GB/s or higher. This presents a fundamental challenge because the skin effect, which exacerbates signal transmission losses at high frequencies. Our results indicate that smooth copper interconnects relatively thin cuprous oxides (Cu2O, CuI) amine-functional silane adhesion promoters improve interfacial epoxy dielectrics by nearly an order magnitude. For first time, we present X-ray photoelectron spectroscopy (XPS) Raman evidence Cu(I)-O-Si bond formation silane-treated interfaces. Thus, can benefit from reduced while maintaining their mechanical integrity reliability. Failure mechanisms Cu cupric oxide (CuO, CuII) explored using scanning electron microscopy (SEM) Auger (AES). These both thick interfaces lead weaker compared promoters.

Language: Английский

Silver Decorated Copper Coordination Polymer for the Electroreduction of CO2 to Hydrocarbon Liquid Fuels DOI

Ann Mariella Babu,

Sobin Mathew, Anitha Varghese

et al.

Journal of environmental chemical engineering, Journal Year: 2025, Volume and Issue: unknown, P. 116675 - 116675

Published: April 1, 2025

Language: Английский

Citations

0
Electrochemical reduction of CO2 to liquid products: Factors influencing production and selectivity DOI
Rana Rashad Mahmood Khan, Ramsha Saleem,

Syeda Satwat Batool

et al.

International Journal of Hydrogen Energy, Journal Year: 2025, Volume and Issue: 128, P. 800 - 832

Published: April 25, 2025

Language: Английский

Citations

0
Activity and Selectivity in the Electrochemical Reduction of CO2 at CuSnx Electrocatalysts Using a Zero-Gap Membrane Electrode Assembly DOI Creative Commons
Monsuru Olatunji Dauda,

John Hendershot,

Mustapha Bello

et al.

Journal of The Electrochemical Society, Journal Year: 2024, Volume and Issue: 171(8), P. 084503 - 084503

Published: Aug. 1, 2024

In this study Cu, Sn, and bimetallic CuSn x nanoparticles were synthesized evaluated as electrocatalysts for CO 2 reduction using zero gap membrane electrode assemblies. Results show with Sn contents above 10% yield formate a primary product Faradaic Efficiencies near 70% at 350 mA cm −2 . Cu-Sn less than current densities below relatively lower cell potentials. When the low-Sn content in alkaline anolytes , ethanol was recorded (FE = 48.5% E ≥ 3.0 V). We propose enhanced C activity selectivity originate from Cu dimers adjacent to atoms electrocatalyst content. The active sites are lost when surface exceeds 25%–38%.

Language: Английский

Citations

1
Fundamental Insights into Copper-Epoxy Interfaces for High-Frequency Chip-to-Chip Interconnects DOI
J.M. Park, Monsuru Olatunji Dauda, Mustapha Bello

et al.

ACS Applied Materials & Interfaces, Journal Year: 2024, Volume and Issue: 17(1), P. 2480 - 2490

Published: Dec. 18, 2024

Future processes and materials are needed to enable multichip packages with chip-to-chip (C2C) data rates of 50 GB/s or higher. This presents a fundamental challenge because the skin effect, which exacerbates signal transmission losses at high frequencies. Our results indicate that smooth copper interconnects relatively thin cuprous oxides (Cu2O, CuI) amine-functional silane adhesion promoters improve interfacial epoxy dielectrics by nearly an order magnitude. For first time, we present X-ray photoelectron spectroscopy (XPS) Raman evidence Cu(I)-O-Si bond formation silane-treated interfaces. Thus, can benefit from reduced while maintaining their mechanical integrity reliability. Failure mechanisms Cu cupric oxide (CuO, CuII) explored using scanning electron microscopy (SEM) Auger (AES). These both thick interfaces lead weaker compared promoters.

Language: Английский

Citations

0