Sub‐Skin‐Depth Nanoslit Integrated Topological Insulator Devices for Self‐Driven Broadband Terahertz Detection and Imaging
Shiqi Lan,
No information about this author
Han Li,
No information about this author
Chenyu Yao
No information about this author
et al.
Laser & Photonics Review,
Journal Year:
2025,
Volume and Issue:
unknown
Published: March 25, 2025
Abstract
The
advancement
of
terahertz
technology
is
primarily
fueled
by
the
imperative
for
room‐temperature
operation
with
high
sensitivity,
integration,
and
broadband
detection
capabilities.
Nevertheless,
traditional
semiconductor
materials
in
detectors
continue
to
grapple
obstacles,
notably
intricate
integration
processing
complexities.
unique
electronic
structures
non‐trivial
topological
properties
two‐dimensional
bring
new
possibilities
perspectives
high‐performance
low‐energy
photon
detection.
Here,
an
antenna
combined
insulator
GeBi
4
Te
7
ultrashort
channel
technique
utilized
significantly
enhance
electromagnetic
response
a
confined
region
compressing
localizing
optical
field
spatial
dimension.
This
strategy
achieves
preferential
flow
hot
carriers
through
enhanced
light‐matter
interactions
while
satisfying
bandwidth
speed
detector.
sensitivity
detector
3.04
A·W
−1
at
0.81
THz
noise
equivalent
power
less
than
15.8
pW·Hz
−0.5
time
5
µs.
These
research
results
provide
brand‐new
opportunity
develop
highly
sensitive,
integrated,
detectors,
enabling
exploration
across
diverse
array
application
domains.
Language: Английский
Research Progress on Micromachining Technologies Used to Fabricate Terahertz Micro-Metallic Rectangular Cavity Structures
Xiaolei Bi,
No information about this author
Xuemin Li,
No information about this author
Bin Li
No information about this author
et al.
Micromachines,
Journal Year:
2025,
Volume and Issue:
16(5), P. 518 - 518
Published: April 28, 2025
Terahertz
metal
rectangular
cavity
structures
are
widely
used
in
terahertz
devices
due
to
their
performance
advantages,
and
various
microfabrication
techniques
have
been
applied
the
manufacturing
of
high
performance.
In
this
paper,
several
typical
application
fields
technology
reasons
for
its
these
elaborated
detail.
Several
with
introduced
The
research
progress
micromachining
structures,
such
as
DRIE,
UV-LIGA,
micro-milling,
LTCC,
3D
printing,
electrochemical
micromachining,
is
discussed
Finally,
advantages
disadvantages
micro-rectangular
discussed,
results
show
that
micro-nano
printing
relatively
promising
methods
high-frequency
structures.
Language: Английский