Review of Short-Wavelength Infrared Flip-Chip Bump Bonding Process Technology

Sensors, Journal Year: 2025, Volume and Issue: 25(1), P. 263 - 263

Published: Jan. 5, 2025

Short-wave infrared (SWIR) imaging has a wide range of applications in civil and military fields. Over the past two decades, significant efforts have been devoted to developing high-resolution, high-sensitivity, cost-effective SWIR sensors covering spectral from 0.9 μm 3 μm. These advancements stimulate new prospects across array fields including life sciences, medical diagnostics, defense, surveillance, security, free-space optics (FSO), thermography, agriculture, food inspection, LiDAR applications. In this review, we begin by introducing monolithic image hybrid indicate that flip-chip bump bonding technology remains predominant integration method for owing its outstanding performance, adaptable with innovative epitaxial materials, long-term stability, reliability. Subsequently, comprehensively summarize recent thin-film sensors, encompassing FPAs InGaAs Ge (Sn) sensors. Finally, summary outlook regarding development are provided discussed. The ongoing evolution is poised foster both academic industry

Language: Английский

High-performance flexible UV sensor based on CNT-PAN/Ga2O3 composite films

Journal of Materials Science Materials in Electronics, Journal Year: 2025, Volume and Issue: 36(9)

Published: March 1, 2025

Language: Английский