Advanced Engineering Materials,
Journal Year:
2024,
Volume and Issue:
unknown
Published: Dec. 20, 2024
As
the
electronic
industry
continues
to
progress,
there
is
a
parallel
increase
in
demand
of
materials
for
advanced
electromagnetic
interference
(EMI)
shielding.
A
hybrid
approach
introduced
by
combining
3D
geometrical
structure
with
integration
radar‐absorbing
(RAMs)
develop
absorptive
materials.
Present
study
involves
fabrication
polylactic
acid‐based
pyramidal
honeycomb
structures
using
printing
technology,
followed
electroless
silver
plating
and
infusion
Fe
3
O
4
/epoxy
composite.
These
developed
structures/materials
test
comprehensive
within
frequency
range
8.2–12.4
GHz
(X‐band)
free
space,
waveguide
methods,
focusing
on
both
properties
RAM
EMI
shielding
performance
structures.
Experimental
results
showcase
exceptional
potential
fabricated
structures,
demonstrating
efficient
up‐to
−55
dB,
equivalent
99.999%
attenuation
EM
waves.
Particularly
noteworthy
dominant
role
absorption
as
primary
mechanism,
evidenced
more
than
99%
(−20
dB)
across
entire
tested
spectrum.
Soft Science,
Journal Year:
2025,
Volume and Issue:
5(1)
Published: Jan. 22, 2025
With
the
continuous
development
of
small
and
medium-sized
electronic
devices,
which
bring
convenience
to
people’s
lives,
electromagnetic
wave
(EMW)
pollution
has
emerged
as
a
significant
issue.
The
materials
with
interference
(EMI)
shielding
capabilities
for
protection
against
harmful
radiation
plays
vital
role.
Currently,
wide
range
multifunctional,
lightweight
EMI
have
been
created
address
various
environmental
requirements.
However,
single
material
difficult
meet
requirements
high-speed
transmission
equipment
because
when
such
devices
operate
at
high
speeds,
they
typically
generate
elevated
temperatures,
excessive
further
exacerbates
heat
accumulation,
reducing
both
efficiency
lifespan.
Therefore,
thermal
management
is
essential
lower
operating
temperatures
ensure
optimal
performance.
Phase
change
(PCMs)
are
known
storing
large
amount
energy,
potential
in
management,
so
flexible
phase
composites
(PCCs)
emerged.
This
review
provides
detailed
examination
based
on
fillers,
PCMs
latest
advancements
developing
new
PCCs.
Finally,
we
suggest
some
research
directions
PCCs,
hoping
contribute
rapid
advancement
next-generation
electronics,
human
artificial
intelligence.
Advanced Functional Materials,
Journal Year:
2025,
Volume and Issue:
unknown
Published: Jan. 28, 2025
Abstract
Excessive
electromagnetic
pollution
caused
by
waves
can
interfere
with
the
normal
use
of
electronic
devices
or
cause
unnecessary
damage
to
human
health.
Although
conductive
polymer
composites
(CPCs)
are
used
replace
traditional
metals
as
an
effective
strategy
for
managing
undesirable
waves,
CPCs
have
a
non‐negligible
trade‐off
in
enhancement
interference
(EMI)
shielding
effectiveness
and
absorption
coefficient
because
their
reflection‐dominated
EMI
mechanism.
Therefore,
alleviate
secondary
pollution,
absorption‐dominated
asymmetric
structures
urgently
needed.
Recently,
structural
designs
advanced
significantly,
but
seldom
been
summarized
discussed
detail.
Consequently,
this
review
first
systematically
summarizes
current
progress
after
brief
clarification
about
necessity
configuration
structure
design.
Afterward,
various
fiber,
layered,
porous,
composite
described.
Besides,
versatility
is
briefly
introduced.
Finally,
challenges
prospects
proposed
guide
future
advancement
field.
Small,
Journal Year:
2024,
Volume and Issue:
unknown
Published: Oct. 31, 2024
Abstract
With
the
increasing
application
of
electronic
devices,
absorption‐dominated
electromagnetic
interference
shielding
materials
(EMISM)
have
garnered
significant
attention
for
preventing
secondary
pollution.
In
this
study,
polyethyleneimine
(PEI)‐modified
MXene
(PEI@MXene)
is
fabricated
and
achieved
its
controlled
distribution
on
pore
walls
polyarylene
ether
nitrile
(PEN)
porous
films
via
phase
inversion
method
(PIM)
to
obtain
a
closed
skeleton
(CPS–MPW).
The
resulting
PEI@MXene/PEN
composite
film
(CFx)
exhibited
EMIS
efficiency
(EMISE).
Attributing
strong
interaction
between
PEI
hydrophilic
segment
amphiphilic
Pluronic
F127,
with
hydrophobic
anchored
by
PEN
matrix,
PEI@MXene
directionally
distributed
CFx.
addition,
from
cladding
isolating
it
honeycomb
pores,
obtained
CFx
are
insulators
without
forming
conductive
network.
As
result,
these
demonstrate
EMISE
highest
SE
T
41.2
dB
coefficient
A
higher
than
0.51.
Further
continuous
hot
pressing
results
in
thinner
denser
an
impressive
specific
up
750
cm
−1
.
successful
fabrication
CPS–MPW‐type
provides
reference
developing
preparing
novel
EMISM.
Advanced Functional Materials,
Journal Year:
2025,
Volume and Issue:
unknown
Published: Jan. 15, 2025
Abstract
It
is
crucial
to
develop
electromagnetic
interference
(EMI)
shielding
materials
with
high
efficiency
(SE)
and
reduced
reflection
mitigate
the
secondary
pollution
caused
by
waves
(EMWs).
Herein,
a
novel
multilayer
assembly
strategy
inspired
structure
of
“Turkish
dessert—Baklava”
proposed
introduce
magnetic
hollow
Fe
3
O
4
nanospheres
(HFO)
conductive
MXene
nanosheets
into
bacterial
cellulose
(BC)
network.
Through
layer‐by‐layer
vacuum
filtration
approach,
composite
BC/MXene/HFO
film
controllable
electric‐magnetic
dual‐gradient
achieved.
The
construction
dual
gradients
alleviates
impedance
mismatch
at
air‐film
interface,
resulting
in
reflectivity
toward
EMWs,
while
unique
HFO
facilitates
“absorption–reflection–reabsorption”
process
EMWs.
Consequently,
as‐prepared
(0.35
mm
thickness)
exhibits
an
extraordinary
EMI
SE
67.6
dB
as
low
5.1
dB.
Furthermore,
it
also
demonstrates
exceptional
mechanical
properties,
efficient
thermal
management,
Joule
heating
capabilities,
well
remarkable
passive
active
infrared
camouflage
performances.
This
study
offers
innovative
approach
achieve
less
more
absorption
expands
application
scope
precision
electronics,
aerospace,
military
equipment
fields.
Advanced Functional Materials,
Journal Year:
2025,
Volume and Issue:
unknown
Published: Feb. 24, 2025
Abstract
The
great
application
potential
of
terahertz
(THz)
waves
in
communication,
imaging,
and
other
cutting‐edge
fields
makes
them
vulnerable
to
harsh
environments.
THz
electromagnetic
interference
(EMI)
shielding
materials
that
are
applicable
capable
with
standing
environments
critically
important
for
ensuring
the
reliable
operation
electronic
devices
urgently
needed.
Herein,
UV
light‐cured
SiC
whisker
(SiC
w
)@MXene/SiOC
composites
different
:MXene
mass
ratios
developed
through
electrostatic
self‐assembly.
influence
MXene
exfoliation
routes
on
EMI
performance
@MXene/SiOC
investigated
deep.
results
indicated
@HF‐MXene/SiOC
ratio
1:1
exhibited
best
performance,
abundant
heterointerfaces
formed
between
enhanced
wave
attenuation.
Subsequently,
Gyroid
triple
periodic
minimal
surface
(TPMS)
metastructures
fabricated
by
vat
photopolymerization
(VPP)
3D
printing.
All
obtained
a
thickness
1.3–2.7
mm
superior
properties
an
average
efficiency
(SE)
58.6–66.4
dB
0.2–1.6
THz.
Moreover,
Gyroid‐2.5
metastructure
even
low
thermal
conductivity
electron‐to‐thermal
conversion
properties.
facilitates
development
next‐generation
