Advanced Materials,
Journal Year:
2024,
Volume and Issue:
36(48)
Published: Oct. 9, 2024
Abstract
The
advancement
of
thin,
lightweight,
and
high‐power
electronic
devices
has
increasingly
exacerbated
issues
related
to
electromagnetic
interference
heat
accumulation.
To
address
these
challenges,
a
spray‐drying‐sintering
process
is
employed
assemble
chain‐like
CoNi
flake
boron
nitride
(BN)
into
hydrangea‐like
CoNi@BN
heterostructure
fillers.
These
fillers
are
then
composited
with
polydimethylsiloxane
(PDMS)
develop
CoNi@BN/PDMS
composites,
which
integrate
low‐frequency
microwave
absorption
thermal
conductivity.
When
the
volume
fraction
44
vol%
mass
ratio
BN
3:1,
composites
exhibit
optimal
performance
in
both
achieve
minimum
reflection
loss
−49.9
dB
effective
bandwidth
2.40
GHz
(3.92–6.32
GHz)
at
thickness
4.4
mm,
fully
covering
n79
band
(4.4–5.0
for
5G
communications.
Meanwhile,
in‐plane
conductivity
(
λ
∥
)
7.31
W
m
−1
K
,
≈11.4
times
(0.64
pure
PDMS,
32%
higher
than
that
(CoNi/BN)/PDMS
(5.52
same
obtained
through
direct
mixing.
Advanced Materials,
Journal Year:
2024,
Volume and Issue:
unknown
Published: Dec. 4, 2024
Abstract
Electromagnetic
interference
(EMI)
shielding
materials
with
low
electromagnetic
(EM)
waves
reflection
characteristics
are
ideal
for
blocking
EM
radiation
and
pollution.
Materials
reflectivity
must
be
constructed
using
excellent
absorption
properties.
However,
simultaneously
possessing
both
EMI
performance
remain
scarce,
consequently,
multilayer
structures
need
to
developed.
Poly(p‐phenylene–2,6–benzobisoxazole)
nanofibers
(PNF)
prepared
by
deprotonation.
PNF
combined
MXene
heterostructure
MXene@Ni
in‐situ
growth;
MXene@Ni/PNF
acts
as
an
layer
while
MXene/PNF
reflective
layer.
Finally,
(MXene@Ni/PNF)–(MXene/PNF)
aerogels
layer‐by‐layer
freeze‐drying
based
on
the
layered
modular
design
concept.
Experimental
characterizations
revealed
that
enable
efficient
absorption‐reflection‐reabsorption
of
waves,
effectively
eliminating
EMI.
When
mass
ratio
Ni
in
is
1:6
fraction
80
wt.%,
exhibit
(71
dB)
a
very
coefficient
(R
=
0.10).
Finite
element
simulations
verified
developed
asymmetric
structural
achieve
high
characteristics.
In
addition,
display
infrared
camouflage
ability.
Nano-Micro Letters,
Journal Year:
2025,
Volume and Issue:
17(1)
Published: Feb. 6, 2025
Abstract
A
series
of
divinylphenyl-acryloyl
chloride
copolymers
(PDVB-
co
-PACl)
is
synthesized
via
atom
transfer
radical
polymerization
employing
tert-butyl
acrylate
and
divinylbenzene
as
monomers.
PDVB-
-PACl
utilized
to
graft
on
the
surface
spherical
aluminum
nitride
(AlN)
prepare
functionalized
AlN
(AlN@PDVB-
-PACl).
Polymethylhydrosiloxane
(PMHS)
then
used
matrix
thermally
conductive
AlN@PDVB-
-PACl/PMHS
composites
with
fillers
through
blending
curing.
The
grafting
synchronously
enhances
hydrolysis
resistance
its
interfacial
compatibility
PMHS
matrix.
When
molecular
weight
5100
g
mol
−1
density
0.8
wt%,
containing
75
wt%
exhibit
optimal
comprehensive
performance.
thermal
conductivity
(
λ
)
composite
1.14
W
m
K
,
which
by
20%
420%
compared
simply
physically
blended
AlN/PMHS
pure
PMHS,
respectively.
Meanwhile,
display
remarkable
hydrothermal
aging
retaining
99.1%
after
soaking
in
90
°C
deionized
water
for
80
h,
whereas
decreases
sharply
93.7%.
Nano-Micro Letters,
Journal Year:
2025,
Volume and Issue:
17(1)
Published: Feb. 7, 2025
Abstract
The
microstructure
design
for
thermal
conduction
pathways
in
polymeric
electrical
encapsulation
materials
is
essential
to
meet
the
stringent
requirements
efficient
management
and
runaway
safety
modern
electronic
devices.
Hence,
a
composite
with
three-dimensional
network
(Ho/U-BNNS/WPU)
developed
by
simultaneously
incorporating
magnetically
modified
boron
nitride
nanosheets
(M@BNNS)
non-magnetic
organo-grafted
BNNS
(U-BNNS)
into
waterborne
polyurethane
(WPU)
synchronous
molding
under
horizontal
magnetic
field.
results
indicate
that
continuous
in-plane
formed
M@BNNS
aligned
along
field
direction,
combined
bridging
structure
established
U-BNNS,
enable
Ho/U-BNNS/WPU
exhibit
exceptional
(
λ
//
)
through-plane
conductivities
⊥
).
In
particular,
addition
of
30
wt%
5
composites
reach
11.47
2.88
W
m
−1
K
,
respectively,
which
representing
194.2%
improvement
compared
single
orientation
M@BNNS.
Meanwhile,
exhibits
distinguished
capabilities
as
interface
LED
chips.
also
demonstrate
excellent
flame
retardancy,
peak
heat
release
total
reduced
58.9%
36.9%,
WPU.
Thus,
this
work
offers
new
insights
thermally
conductive
structural
flame-retardant
systems
polymer
composites,
presenting
broad
application
potential
packaging
fields.
