Journal of Alloys and Compounds, Journal Year: 2024, Volume and Issue: 1003, P. 175691 - 175691
Published: July 23, 2024
Language: Английский
Journal of Alloys and Compounds, Journal Year: 2024, Volume and Issue: 1003, P. 175691 - 175691
Published: July 23, 2024
Language: Английский
Polymer Composites, Journal Year: 2024, Volume and Issue: 45(7), P. 6287 - 6304
Published: Feb. 10, 2024
Abstract Two‐dimensional hexagonal boron nitride (hBN) based nanocomposites exhibit excellent mechanical and thermal properties for various electronics, automotive, aerospace applications. The present work gives a novel approach to fabricating nitride/epoxy using isopropanol dimethyl ketone as dispersants in two different routes predict characteristics employing deep learning machine models. Nanocomposites were fabricated by casting techniques with varying concentrations of hBN, spanning from 0.25 1 wt%, utilizing dispersing solvents. analyzed behavior, highlighting notable improvement the at 0.5 wt% dispersed hBN. It showcased 61% tensile strength, 38.41% increase flexural 35.80% modulus respectively compared pristine epoxy. Halpin Tsai analytical model showed agreement elastic calculated experimentally. fractured SEM micrograph supported improved dispersion hBN nanocomposite. Thermal stability hBN/epoxy nanocomposite revealed an 8°C 50% degradation Linear regression, random forest support vector neural network (DNN) employed values. DNN proved better results showcasing low prediction loss high R 2 values (0.99468–0.99966). Highlights dispersants. 0.5% loading exhibited characteristics. was evaluating theoretical modulus. Improved filler optimized combination. Deep higher value lower loss.
Language: Английский
Citations
7ACS Applied Nano Materials, Journal Year: 2024, Volume and Issue: 7(5), P. 5009 - 5018
Published: Feb. 24, 2024
Polyimide (PI) with excellent comprehensive properties has been extensively applied in electronic devices. The miniaturization and integration of electrical equipment put forward more stringent requirements for heat dissipation, so a composite high thermal conductivity low dielectric become critical factor. In this work, fluorinated graphene (FG) boron nitride nanosheets modified polydopamine (PDA@BNNS) were filled into the PI matrix as fillers to prepare FG/PDA@BNNS/PI composites. mixed filling FG BNNS synergistically improves conductivity, research breaks balance barrier between conductivity. resulting 4.99 wt % exhibited properties, including ultralow constant 1.67, loss 0.013 at 1 MHz, 2.464 W m–1 K–1. addition, film also showed standout breakdown resistance (81.22 kV/mm) mechanical such that tensile strength reached 35.7 MPa. This report can inspire future development composites packaging.
Language: Английский
Citations
7Polymer, Journal Year: 2024, Volume and Issue: 307, P. 127245 - 127245
Published: June 3, 2024
Language: Английский
Citations
7Polymer Composites, Journal Year: 2024, Volume and Issue: 45(10), P. 9530 - 9542
Published: April 9, 2024
Abstract The expanding realm of high‐frequency electronics necessitates materials with exceptional attributes: notably, a low dielectric constant ( D k ) to minimize signal propagation delays, high thermal conductivity for effective heat dissipation, higher breakdown strength, and robust mechanical properties withstand demanding operational environments. While cycloolefin copolymers (COC) excel in electrical insulation, chemical resistance, durability, their intrinsic slightly compared other polymers, along challenges such as poor dispersibility compatibility nanoparticles, hinder full potential this domain. Considering these drawbacks, study fabricated series COC/mica composites by integrating natural mica particles into the COC matrix via CTAB‐assisted surface modification enhance mitigating particle aggregation through in‐situ mixing hot‐press methods. resultant demonstrate an outstanding ultra‐low 1.44, marking significant decrease over 36% pristine 2.26, exceptionally loss δ 0.00013 at frequency 10 GHz, strength ~49.40 kV/mm enhanced up 0.88 W/(m K) 40% loading. Additionally, heightened performances like tensile 69 MPa 6.5% elongation break, impact ~17.9 kJ × m −2 , water resistance absorption below 0.097%. These performance above mentioned can meet stringent requirements modern packaging next generation development. Highlights Surface CTAB homogeneous composites. Achieved pure COC. Thermal improved significantly incorporation mica. Unlocking applications ultralow performance.
Language: Английский
Citations
6Polymer Composites, Journal Year: 2024, Volume and Issue: 45(8), P. 7574 - 7585
Published: March 4, 2024
Abstract Barium titanate (BaTiO 3 , BT)/poly (vinylidene fluoride, PVDF) composites containing 0%–50% of ceramic filler volume fraction were fabricated by spin‐coating method, and it was shown that the permittivity BT/PVDF increased with addition filler. In order to enhance interfacial bonding between two phases, surface modification treatment BT particles carried out using different mass fractions γ‐Aminopropyl‐triethoxysilane (KH550). The results indicated dielectric properties modified enhanced. constant composite 10 vol.% treated 1 wt.% KH550 is 20.3, which twice as much pure PVDF. A model employed COMSOL Multiphysics simulate analyze effects particle size, fraction, degree dispersion on films from perspective microstructural. Calculated show triggers local electric field distortion, affects composites. Meanwhile, also breakdown resistance material, when uniformly dispersed, reduced, effectively enhances material. Finite element simulation analyzes macroscopic a microstructural point view, beneficial for further understanding ceramic‐polymer Highlights polymer matrix enhanced doping BT. can in surface‐modified improved composite. confirmed effectiveness interface modification.
Language: Английский
Citations
5ACS Applied Nano Materials, Journal Year: 2024, Volume and Issue: 7(10), P. 11803 - 11815
Published: May 8, 2024
The development of heterostructures offers an effective method for influencing thermal transport mechanisms. This work presents the preparation heterostructured, thermally conductive alumina nanosphere@boron nitride nanosheet (f-A@B) fillers that resemble "sesame crackers" using in situ approach. Benefited from synergistic effect zero-dimensional (0D) alumina/two-dimensional (2D) boron (BNNS) which and BNNS are boned at interface, f-A@B/poly(dimethylsiloxane) (PDMS) nanocomposites presented excellent heat dissipation efficiency. uniformly connecting to interlaminar is essential supplying a conduction channel. At mass fraction 30 wt % f-A@B, f-A@B/PDMS nanocomposite optimal conductivity (κ) 3.72 W m–1 K–1, 1279% increase over pure PDMS. modified Hashin–Shtrikman (MHS) model verifies explains experimental results, suggesting reduced filler-to-filler interfacial resistance accounts construction f-A@B heterostructure. Meanwhile, as-prepared composites also exhibit exceptional volume resistivity up 2.2 × 1013 Ω cm, 4 orders magnitude greater than critical electrical insulation (109 cm). with superior insulating properties may open future opportunities packaging management.
Language: Английский
Citations
5Colloids and Surfaces A Physicochemical and Engineering Aspects, Journal Year: 2024, Volume and Issue: 686, P. 133377 - 133377
Published: Feb. 3, 2024
Language: Английский
Citations
4Polymer Composites, Journal Year: 2024, Volume and Issue: 45(12), P. 10686 - 10699
Published: May 7, 2024
Abstract Thermal conductive polymer composites have broad application prospects in the field of thermal management. However, due to intrinsically low conductivity polymers, even if fillers with high mass fraction are filled, cannot be significantly improved. In this paper, bimodal diamond particles (70 wt.% 150 μm and 22 25 μm) were incorporated into phenolic resin construct continuous heat transfer pathways by close packing, thereby enhancing its conductivity. The results indicated that smaller particle size can effectively bridge gaps between larger ones, forming a for conduction. As result, maximum value 12.45 W/(m·K) achieved, which is 65.5 times, 9.8 times 8.4 higher than pure resin, reinforced composite composite, respectively. Furthermore, dissipation water cooling experiments also confirm superior performance particles. When heating voltage 10 V rate 30 mL/min, upper surface temperature 129.2°C lower resin. This investigation provides new type conductivity, has promising It insights preparing packing Highlights Surface modification filler enhances combination interfacial bonding will enhanced D–OH bond on surface. Bimodal lead formation closely packed structure. special structure form three‐dimensional conduction network. highest TC DD/PR W/(m·K).
Language: Английский
Citations
4Ceramics International, Journal Year: 2024, Volume and Issue: 50(20), P. 38462 - 38470
Published: July 16, 2024
Language: Английский
Citations
4Published: Jan. 1, 2025
Language: Английский
Citations
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