Advanced Science,
Journal Year:
2025,
Volume and Issue:
unknown
Published: May 28, 2025
Abstract
The
miniaturization
and
high‐power
density
of
electronic
devices
present
new
challenges
for
thermal
management.
Efficient
heat
dissipation
in
electrically
insulating
packaging
materials
is
currently
limited
by
the
conductivity
thermal‐interface
(TIMs)
their
ability
to
effectively
direct
toward
sinks.
In
this
study,
MgO‐based
composites
with
high
conductivities
are
fabricated
achieve
excellent
performances
optimizing
heat‐transfer
path.
These
produced
using
a
protein
foaming
method,
which
forms
interconnected
ceramic‐filler
networks.
Additionally,
liquid
phase
formed
during
sintering
MgO
enhances
bonding
epoxy
matrix,
thereby
improving
composites.
As
result,
54.64
vol%
17.19
W
m
−1
K
,
101
times
higher
than
that
pure
epoxy,
3.7
randomly
dispersed
composites,
even
superior
nitride‐based
Moreover,
also
exhibited
low
thermal‐expansion
coefficient
(27.76
ppm
°C
)
electrical‐insulation
strength
(51.51
kV
mm
),
ensuring
good
electrical
performance
electronic‐packaging
applications.
strategic
design
TIM
microstructures
directing
offers
promising
solution
efficient
management
integrated
electronics.
Small Methods,
Journal Year:
2025,
Volume and Issue:
unknown
Published: May 8, 2025
Abstract
Due
to
its
high
thermal
and
low
electrical
conductivities,
boron
nitride
(BN)
has
emerged
as
an
optimal
filler
for
interface
materials
(TIMs)
that
prevent
condensation
of
nanostructures
without
causing
shutdown
due
electron
tunneling.
The
polymer
composite
based
on
the
BN
hybrid
strategy
can
be
considered
option
electrically
insulating
heat‐dissipating
TIM.
However,
there
is
a
paucity
systematic
experiments
theoretical
approaches
investigating
content
ratio
fillers,
which
are
key
factors
in
synergistically
improving
conductivity
(TC).
In
this
study,
percolation
model
developed
by
modifying
Foygel
investigate
synergistic
improvement
systematically
measured
TC.
effectively
determines
composition
resultant
performance
enhancement.
Furthermore,
impact
surface
chemistry
comprehensively
analyzed
conjunction
with
network
structure.
highest
isotropic
TC
(10.93
W
m
−1
·K)
achieved
optimizing
formation
nano‐interconnections
between
1D
nanotube
2D
hexagonal
(h‐BN),
representing
significant
1582%
118%
over
pure
epoxy
containing
optimized
h‐BN
network,
respectively.
Polymer Composites,
Journal Year:
2025,
Volume and Issue:
unknown
Published: May 23, 2025
ABSTRACT
This
work
presents
a
novel
approach
to
valorizing
chromium‐containing
leather
waste
by
converting
it
into
biochar
and
incorporating
as
sustainable
functional
filler
in
epoxy
composites
cured
with
cardanol‐derived
phenalkamine
(CPKA).
The
resulting
waste‐derived
(LWB)/epoxy
exhibited
significantly
enhanced
tensile
modulus,
thermal,
dielectric
properties.
Epoxy
20%
LWB
demonstrated
substantial
property
enhancements,
the
modulus
increasing
from
328
±
18
806
14
MPa
thermal
conductivity
improving
83%
0.55
W/(m·K).
Thermogravimetric
analysis
properties
compared
neat
epoxy,
while
measurements
showed
an
increase
both
constant
loss
addition
of
LWB.
In
addition,
hexavalent
chromium
levels
remained
within
acceptable
range
for
general
plastic
products,
confirming
their
safety
suitability
broad
industrial
applications.
These
findings
demonstrate
effective
strategy
hazardous
valuable
fillers
high‐performance
composites,
promising
applications
structural
components,
electronic
encapsulation,
electromagnetic
interference
shielding.
Polymers,
Journal Year:
2025,
Volume and Issue:
17(11), P. 1507 - 1507
Published: May 28, 2025
As
one
of
the
most
widely
used
packaging
materials,
epoxy
composite
(EP)
offers
excellent
insulation
properties;
however,
its
intrinsic
low
thermal
conductivity
(TC)
limits
application
in
high-frequency
and
high-power
devices.
To
enhance
TC
EP,
six
highly
thermally
conductive
inorganic
fillers,
namely,
Al2O3,
MgO,
ZnO,
Si3N4,
h-BN,
AlN,
were
incorporated
into
EP
matrix
at
varying
contents
(60-90
wt.%).
The
resulting
molding
compounds
(EMCs)
demonstrated
significant
improvement
coefficient
(λ)
high
filler
(90
wt.%),
ranging
from
0.67
W
m-1
K-1
to
1.19
K-1,
compared
pristine
preform
(ECP,
0.36
K-1).
However,
it
was
found
that
interfacial
resistance
(ITR)
between
materials
is
a
major
hindrance
restricting
improvement.
In
order
address
this
challenge,
graphene
nanosheets
(GNSs)
carbon
nanotubes
(CNTs)
introduced
as
additives
reduce
ITR.
experimental
results
indicated
CNTs
effective
enhancing
TC,
with
optimized
EMC
achieving
λ
value
1.14
using
60
wt.%
Si3N4
+
2
CNTs.
Through
introduction
small
amount
CNT
(2
content
significantly
reduced
90
while
still
maintaining
(1.14
We
propose
addition
helps
construction
partial
heat
conduction
network
within
matrix,
thereby
facilitating
transfer.
