A tree-shaped high thermal conductivity channel in a stacked chip with minimizing maximum temperature difference and entropy generation rate DOI Creative Commons

Xuetong Xi,

Huijun Feng,

Lingen Chen

et al.

Case Studies in Thermal Engineering, Journal Year: 2024, Volume and Issue: unknown, P. 105734 - 105734

Published: Dec. 1, 2024

Language: Английский

A tree-shaped high thermal conductivity channel in a stacked chip with minimizing maximum temperature difference and entropy generation rate DOI Creative Commons

Xuetong Xi,

Huijun Feng,

Lingen Chen

et al.

Case Studies in Thermal Engineering, Journal Year: 2024, Volume and Issue: unknown, P. 105734 - 105734

Published: Dec. 1, 2024

Language: Английский

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