A coupled finite element–boundary element method for transient elastic dynamic analysis of electronic packaging structures DOI
Yanpeng Gong,

Y. He,

Han Hu

et al.

Engineering Structures, Journal Year: 2024, Volume and Issue: 326, P. 119500 - 119500

Published: Dec. 21, 2024

Language: Английский

A coupled finite element–boundary element method for transient elastic dynamic analysis of electronic packaging structures DOI
Yanpeng Gong,

Y. He,

Han Hu

et al.

Engineering Structures, Journal Year: 2024, Volume and Issue: 326, P. 119500 - 119500

Published: Dec. 21, 2024

Language: Английский

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