Machines,
Journal Year:
2025,
Volume and Issue:
13(1), P. 40 - 40
Published: Jan. 9, 2025
This
study
aimed
to
enhance
the
efficiency
and
surface
quality
of
shear-thickening
polishing
(STP)
for
optical
glass
through
optimizing
parameters.
Sixteen
orthogonal
experiments
were
conducted
assess
effects
speed
(V),
angle
(θ),
slurry
concentration
(C)
on
material
removal
rate
(MRR)
roughness
(Ra).
Grey
relational
analysis
simplified
multi-objective
optimization
problem,
a
regression
model
was
formulated
determine
optimal
combination
The
results
indicate
that
has
most
significant
impact
objective,
followed
by
angle,
whereas
least
effect.
Under
parameters—polishing
70
rpm,
70°,
12%—the
(Ra)
significantly
reduced
8.23
nm
during
20
min
process,
while
reached
813.63
nm/min.
Shear-thickening
under
optimized
process
parameters
can
effectively
remove
scratches
from
workpiece
quality.
Scientific Reports,
Journal Year:
2025,
Volume and Issue:
15(1)
Published: Feb. 13, 2025
Lithium
tantalate
(LiTaO3,
LT)
single
crystal
has
been
widely
applied
in
the
fields
of
electro-optical
and
piezoelectric
devices.
In
this
study,
diamond
fixed-abrasive
tools
(FAT)
for
LT
were
fabricated
using
consolidation
abrasive
processing
technology
to
streamline
wafers
enhance
overall
effectiveness.
The
material
properties
critical
depth
ductile-to-brittle
transition
examined
through
nanoindentation
scratch
techniques.
displacement
curve
exhibits
significant
periodic
fluctuations
at
depths
150
nm
above.
load
transition,
as
determined
by
quasi-static
tests,
was
approximately
5.2
mN.
Based
on
calculated
data,
actual
estimated
subsequently
validated
experiments
conducted
varying
loads.
Scanning
electron
microscopy
(SEM)
three-dimensional
surface
morphology
analyses
demonstrated
that
predicted
values
consistent
with
results.
Furthermore,
FAT
developed
study
achieved
superior
roughness
higher
removal
rate
(MRR)
compared
free
method.
Surface
Ra
wafer
processed
could
be
reduced
from
208.6
2.8
nm.
Specifically,
MRR
12.4
μm/h,
whereas
16.3
μm/h.
Additionally,
results
provide
insights
optimization
parameter
selection
processing.
Micromachines,
Journal Year:
2025,
Volume and Issue:
16(4), P. 450 - 450
Published: April 10, 2025
This
study
establishes
a
bidirectional
kinematic
analysis
framework
for
single-sided
chemical
mechanical
polishing
systems
through
innovative
coordinate
transformation
synergies
(rotational
and
translational).
To
address
three
critical
gaps
in
existing
research,
interaction
dynamics
both
pad–wafer
abrasive–wafer
interfaces
are
systematically
derived
via
5-inch
silicon
wafers.
Key
advancements
include
(1)
the
development
of
closed-form
trajectory
equations
resolving
multibody
tribological
interactions,
(2)
vector-based
relative
velocity
quantification
with
17
×
grid
3D
visualization,
(3)
first-principle
parametric
mapping
nonuniformity
(NUV
=
0–0.42)
across
0–80
rpm
operational
regimes.
Numerical
simulations
reveal
two
fundamental
regimes:
near-unity
rotational
speed
ratios
(ωP/ωC
[0.95,
1)
(1,
1.05])
generate
optimal
spiral
trajectories
that
achieve
95%
surface
coverage,
whereas
integer
multiples
produce
stable
velocities
(1.75
m/s
at
60
rpm).
Experimental
validation
demonstrated
0.3
μm/min
removal
rates
<1
μm
under
optimized
conditions,
which
was
attributable
to
stabilization
effects.
The
methodology
exhibits
inherent
extensibility
high-speed
operations
(>80
rpm)
alternative
configurations
adaptability.
work
provides
systematic
derivation
protocol
abrasive
analysis,
visualization
paradigm
optimization,
quantitative
guidelines
precision
process
control—advancing
beyond
current
empirical
approaches
finishing
technology.
