Chemical Engineering Journal, Journal Year: 2024, Volume and Issue: 495, P. 153161 - 153161
Published: June 18, 2024
Language: Английский
SusMat, Journal Year: 2024, Volume and Issue: unknown
Published: Sept. 23, 2024
Abstract The miniaturization, integration, and high data throughput of electronic chips present challenging demands on thermal management, especially concerning heat dissipation at interfaces, which is a fundamental scientific question as well an engineering problem—a death problem called in semiconductor industry. A comprehensive examination interfacial resistance has been given from physics perspective 2022 Review Modern Physics . Here, we provide detailed overview materials perspective, focusing the optimization structure compositions interface (TIMs) interact/contact with source sink. First, discuss impact conductivity, bond line thickness, contact TIMs. Second, it pointed out that there are two major routes to improve transfer through interface. One reduce TIM's ( R TIM ) TIMs strategies like incorporating conductive fillers, enhancing treatment techniques. other c by improving effective contact, strengthening bonding, utilizing mass gradient alleviate vibrational mismatch between source/sink. Finally, such challenges theories, potential developments sustainable TIMs, application AI design also explored.
Language: Английский
Citations
14
Advanced Materials, Journal Year: 2024, Volume and Issue: unknown
Published: July 16, 2024
Abstract The rapid development of the Internet Things (IoT) has accelerated advancement indoor photovoltaics (IPVs) that directly power wireless IoT devices. interest in lead‐free perovskites for IPVs stems from their similar optoelectronic properties to high‐performance lead halide perovskites, but without concerns about toxic leakage environments. However, currently prevalent perovskite IPVs, especially tin (THPs), still exhibit inferior performance, arising uncontrollable crystallization. Here, a novel adhesive bonding strategy is proposed precisely regulating heterogeneous nucleation kinetics THPs by introducing alkali metal fluorides. These ionic adhesives boost work adhesion at buried interface between substrates and film, subsequently reducing contact angle energy barrier nucleation, resulting high‐quality THP films. solar cells achieve an efficiency 20.12% under illumination 1000 lux, exceeding all types successfully powering radio frequency identification‐based sensors.
Language: Английский
Citations
13
Chinese Journal of Polymer Science, Journal Year: 2024, Volume and Issue: 42(7), P. 916 - 925
Published: March 18, 2024
Language: Английский
Citations
9
Advanced Engineering Materials, Journal Year: 2025, Volume and Issue: unknown
Published: Jan. 29, 2025
Electrically insulating thermal interface materials (TIMs) are desired for certain applications to avoid electrical current leakage. However, it is more challenging achieve high conductivity ( κ ) due the noncoalescing nature of ceramic particles. Herein, independent control and TIMs reported, with aid low‐temperature coalescing silver nanoparticles (AgNPs), enhancing , decreasing total resistance R t while retaining insulation. The leakage‐free functionalized phase‐change material (OP) employed as a matrix. interaction between aluminum nitride (AlN) particles OP induces highest surface energy intrinsic adhesion energy, compared other particles, resulting in lowest elastic modulus . (1.7 W m −1 K (80.1 mm 2 OP‐AlN further improved by AgNP decoration (OP‐AlN/Ag). AlN coalesced exquisitely AgNPs (3 vol%), suppressing (<10 −9 S cm ). increased 58% (2.7 decreased 44% (45.0 electrical/thermal pathway may prove useful electrically but thermally highly conducting TIMs.
Language: Английский
Citations
1
Advanced Functional Materials, Journal Year: 2024, Volume and Issue: unknown
Published: June 19, 2024
Abstract Interfaces play an important role in the heat and stress transfer within applications such as electronic cooling. The coexistence of apparently contradictory properties between dissipation adhesion at interfaces poses a constant challenge for existing interface materials. Herein, thermal material is reported, consisting epoxy‐functionalized polydimethylsiloxane aluminum fillers with excellent interfacial heat/force ability. This optimizes combination conductivity 3.46 W m −1 K energy 1.17 kJ −2 . Using two viscoelastic models, force ability attributed to hierarchical via introduction borate ester bonds filler networks. A simple kinetic bond model demonstrates that increase molecular chain segment mobility, allowing full extension debonding dispersion efficient dissipation. networks not only facilitate transfer, but also dissipate mechanical during network destruction due breakage fillers. dispassion stability are further demonstrated when this used flexible light emitting diodes high‐power chips. work provides new strategy balancing transfer.
Language: Английский
Citations
6
Chemical Engineering Journal, Journal Year: 2024, Volume and Issue: 495, P. 153352 - 153352
Published: July 2, 2024
Language: Английский
Citations
5
Langmuir, Journal Year: 2024, Volume and Issue: 40(15), P. 8108 - 8114
Published: April 3, 2024
Although intense efforts have been devoted to the development of thermally conductive epoxy resin composites, most previous works ignore importance contact thermal resistance between composites and mating surfaces. Here, we report on resin/hexagonal boron nitride (h-BN) which show low with contacting surface by tuning adhesion energy. We found that energy increases increasing ratio soybean-based resin/amino silicone oil h-BN contents. The has a negative correlation resistance; is, enhancing will lead reduced resistance. conductance contents is 0.025 mm2·K/W for resin/60 wt % consistent theoretically calculated value. By investigating wettability chain dynamics resin/h-BN confirm stems from increased intermolecular interaction chains. present study provides practical approach enhanced conductivity resistance, aiming effective management electronics.
Language: Английский
Citations
4
Applied Materials Today, Journal Year: 2024, Volume and Issue: 40, P. 102397 - 102397
Published: Aug. 23, 2024
Language: Английский
Citations
4
Chemical Engineering Journal, Journal Year: 2025, Volume and Issue: unknown, P. 162054 - 162054
Published: March 1, 2025
Language: Английский
Citations
0
Advanced Functional Materials, Journal Year: 2024, Volume and Issue: unknown
Published: Nov. 12, 2024
Abstract Self‐hygroscopic hydrogels, characterized by high evaporation enthalpy, cooling efficiency, and self‐regulating properties, have garnered significant attention. However, most current research focuses on enhancing the hygroscopic desorption performance, often overlooking importance of monitoring self‐regulation process, which limits its further application. Advanced visualization technologies, such as in situ electrical impedance tomography, low‐field nuclear magnetic resonance, hyperspectral imaging, offer potential insights into this behavior, yet they require additional devices, incur costs, involve complex sample preparation processes. Therefore, drawing inspiration from nature, humidity‐color‐sensitive hydrogels (HCSHs) strategy is proposed for visualized cooling. Benefiting strong polar responsiveness aggregation‐induced emission (AIE) molecules, hydrogel's fluorescence significantly changes with varying interior water content, thereby process monitored easily. Further, obtained hydrogel could be applied electronic device owing to polymer skeletons’ swelling ratio, adhesion, excellent self‐hygroscopic properties. This overcomes limitations visual technology materials provides new intelligent thermal management devices.
Language: Английский
Citations
3