Fluorine-containing main-chain type active esters as curing agents for epoxy resins to achieve superior dielectric and thermal performances
Xiang Wang,
No information about this author
Xiaoting Liao,
No information about this author
Jizhen Tian
No information about this author
et al.
Progress in Organic Coatings,
Journal Year:
2024,
Volume and Issue:
197, P. 108806 - 108806
Published: Sept. 17, 2024
Language: Английский
Thermosetting Boron-nitride-filled polybutadiene composites with enhanced thermal conductivity and good dielectric properties
Rongrui Shi,
No information about this author
Jing Sun,
No information about this author
Qiang Fang
No information about this author
et al.
Composites Communications,
Journal Year:
2024,
Volume and Issue:
unknown, P. 102128 - 102128
Published: Oct. 1, 2024
Language: Английский
Design and synthesis of poly(styrene-b-(ethylene-co-butadiene)-b-styrene) anion exchange membranes with high ion conductivity
Jianen Huang,
No information about this author
Yiming Liang,
No information about this author
Rui Cai
No information about this author
et al.
Journal of Power Sources,
Journal Year:
2024,
Volume and Issue:
613, P. 234853 - 234853
Published: June 12, 2024
Language: Английский
Hydrogen Bond-Driven Rigid Filling Strategy: Regulation of Epoxy Resin Network Structure and Properties by Anchored Groups
Shuai Li,
No information about this author
Junliang He,
No information about this author
Shitian Han
No information about this author
et al.
Polymer,
Journal Year:
2025,
Volume and Issue:
unknown, P. 128511 - 128511
Published: May 1, 2025
Language: Английский
Crosslinking Vinyl‐Addition Polynorbornenes via Difunctional Diazirines to Generate Low Dielectric‐Constant and Low Dielectric‐Loss Thermosets
Pramod Kandanarachchi,
No information about this author
Gerhard Meyer,
No information about this author
Stefania F. Musolino
No information about this author
et al.
Macromolecular Rapid Communications,
Journal Year:
2024,
Volume and Issue:
45(17)
Published: June 14, 2024
Thermosets
having
low
dielectric
constant
(D
Language: Английский
Reversible Adhesive Film with Ultralow Dielectric Loss in High Frequency via Surface Anchoring of Catechol
ACS Applied Materials & Interfaces,
Journal Year:
2024,
Volume and Issue:
unknown
Published: Sept. 27, 2024
Debonding
of
the
dielectric
adhesive
material
will
make
high-frequency
communication
equipment
unusable,
leading
to
resource
wasting
and
electronic
waste.
Reversible
is
an
ideal
strategy
realize
reuse
debonding
devices,
but
low
loss
requirement
materials
in
devices
limits
its
development.
Here,
surface
anchoring
design
catechol
was
proposed
prepare
a
reversible
film
with
ultralow
high
frequency.
The
structure
linked
end
polybutadiene
(PB)
macromolecule
synthesize
catechol-terminated
PB
(PB-D).
PB-based
(PB-F)
used
as
base
film,
then
PB-D
sprayed
on
PB-F
form
thin
layer.
In
subsequent
curing
process,
group
could
be
anchored
by
cross-linking
reaction
between
heterogeneous
segments.
modification
transforms
interface
copper
foil
into
cohesive
failure
within
layer,
showing
strong
adhesion
more
than
1.1
N/mm.
More
importantly,
relying
hydrogen
bonding
structures,
can
regain
stable
mild
way.
Because
only
distributed
surface,
kept
(
Language: Английский
Epoxidation of 1,2‐Polybutadiene and Its Dielectric, Thermal, and Mechanical Properties
Yasuyuki Mori,
No information about this author
Sho Morinaga,
No information about this author
Ryu Tada
No information about this author
et al.
Macromolecular Chemistry and Physics,
Journal Year:
2024,
Volume and Issue:
unknown
Published: Oct. 18, 2024
Abstract
A
series
of
epoxidized
1,2‐polybutadienes
with
various
degrees
epoxidation
are
synthesized
by
the
reaction
and
m
‐chloroperbenzoic
acid.
Additionally,
curing
behavior
a
cationic
initiator
relationship
between
ratios
dielectric,
thermal,
mechanical
properties
cured
materials
examined.
Language: Английский