Angewandte Chemie,
Journal Year:
2022,
Volume and Issue:
135(5)
Published: Nov. 22, 2022
Abstract
Thermal
conduction
for
electronic
equipment
has
grown
in
importance
light
of
the
burgeoning
5G
communication.
It
is
imperatively
desired
to
design
highly
thermally
conductive
fillers
and
polymer
composite
films
with
prominent
Joule
heating
characteristics
extensive
mechanical
properties.
In
this
work,
“solvothermal
&
situ
growth”
method
carried
out
prepare
“Fungal
tree”‐like
hetero‐structured
silver
nanowires@boron
nitride
nanosheet
(AgNWs@BNNS)
fillers.
The
AgNWs@BNNS/ANF
are
obtained
by
“suction
filtration
self‐assembly
hot‐pressing”.
When
mass
fraction
AgNWs@BNNS
50
wt%,
film
presents
optimal
thermal
conductivity
coefficient
9.44
W/(m
⋅
K)
excellent
tensile
strength
136.6
MPa,
good
temperature‐voltage
response
characteristics,
superior
electrical
stability
reliability,
which
promise
a
wide
application
potential
devices.
ACS Nano,
Journal Year:
2021,
Volume and Issue:
15(6), P. 10000 - 10009
Published: June 4, 2021
Aerogel
has
been
widely
known
as
a
low-density
and
highly
porous
material
is
closely
connected
with
the
complex
processing
methods,
such
freeze–drying
or
supercritical
drying.
In
this
work,
using
polymerization-induced
aramid
nanofiber
(PANF)
building
block,
we
put
forward
modified
freezing–drying
method
for
high-efficiency
preparation
of
all-para-aromatic-amide
aerogels.
process,
PANF
hydrogel
first
frozen
at
−18
°C
then
dried
20–150
formation
aerogel.
The
framework
formed
during
freezing
process
crucial
Moreover,
space-occupying
effect
ice
crystals
also
helpful
macroscopic
pore
structure
in
Aerogels
large
size
well-controlled
shape
could
be
successfully
obtained
by
method.
Through
variation
concentration
drying
temperature,
aerogels
different
densities
(20–185
mg/cm3)
achieved,
lowest
density
reached
150
°C,
0.7%.
show
high
specific
compressive
strengths
low
thermal
conductivities,
which
are
comparable
to
those
resulting
from
Furthermore,
shrinkage
phenomenon
skillfully
utilized
aerogel-coated
objects.
applied
insulating
shock
absorption
practical
applications.
Nano-Micro Letters,
Journal Year:
2023,
Volume and Issue:
15(1)
Published: March 2, 2023
Electronic
skins
can
monitor
minute
physiological
signal
variations
in
the
human
and
represent
body’s
state,
showing
an
emerging
trend
for
alternative
medical
diagnostics
human–machine
interfaces.
In
this
study,
we
designed
a
bioinspired
directional
moisture-wicking
electronic
skin
(DMWES)
based
on
construction
of
heterogeneous
fibrous
membranes
conductive
MXene/CNTs
electrospraying
layer.
Unidirectional
moisture
transfer
was
successfully
realized
by
surface
energy
gradient
push–pull
effect
via
design
distinct
hydrophobic-hydrophilic
difference,
which
spontaneously
absorb
sweat
from
skin.
The
DMWES
membrane
showed
excellent
comprehensive
pressure
sensing
performance,
high
sensitivity
(maximum
548.09
kPa−1),
wide
linear
range,
rapid
response
recovery
time.
addition,
single-electrode
triboelectric
nanogenerator
deliver
areal
power
density
21.6
µW
m−2
good
cycling
stability
harvesting.
Moreover,
superior
performance
enabled
all-range
healthcare
sensing,
including
accurate
pulse
monitoring,
voice
recognition,
gait
recognition.
This
work
will
help
to
boost
development
next-generation
breathable
applications
AI,
interaction,
soft
robots.
Angewandte Chemie,
Journal Year:
2022,
Volume and Issue:
135(5)
Published: Nov. 22, 2022
Abstract
Thermal
conduction
for
electronic
equipment
has
grown
in
importance
light
of
the
burgeoning
5G
communication.
It
is
imperatively
desired
to
design
highly
thermally
conductive
fillers
and
polymer
composite
films
with
prominent
Joule
heating
characteristics
extensive
mechanical
properties.
In
this
work,
“solvothermal
&
situ
growth”
method
carried
out
prepare
“Fungal
tree”‐like
hetero‐structured
silver
nanowires@boron
nitride
nanosheet
(AgNWs@BNNS)
fillers.
The
AgNWs@BNNS/ANF
are
obtained
by
“suction
filtration
self‐assembly
hot‐pressing”.
When
mass
fraction
AgNWs@BNNS
50
wt%,
film
presents
optimal
thermal
conductivity
coefficient
9.44
W/(m
⋅
K)
excellent
tensile
strength
136.6
MPa,
good
temperature‐voltage
response
characteristics,
superior
electrical
stability
reliability,
which
promise
a
wide
application
potential
devices.
