Rutile germanium dioxide: An emerging ultrawide bandgap semiconductor for power device applications – A review

Materials Today, Journal Year: 2025, Volume and Issue: unknown

Published: Jan. 1, 2025

Language: Английский

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Decoupling thermal properties in multilayered systems for advanced thermoreflectance experiments

Physical Review Applied, Journal Year: 2025, Volume and Issue: 23(4)

Published: April 2, 2025

Language: Английский

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Advancing Thermal Management Technology for Power Semiconductors through Materials and Interface Engineering

Accounts of Materials Research, Journal Year: 2025, Volume and Issue: unknown

Published: April 8, 2025

Language: Английский

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Thermal management of through-silicon vias and back-end-of-line layers in 3D ICs: A comprehensive review

Microelectronic Engineering, Journal Year: 2025, Volume and Issue: unknown, P. 112325 - 112325

Published: Feb. 1, 2025

Language: Английский

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Effectively Tuning Phonon Transport across Al/nonmetal Interfaces through Controlling Interfacial Bonding Strength without Modifying Thermal Conductivity

Materials Today Physics, Journal Year: 2025, Volume and Issue: unknown, P. 101676 - 101676

Published: Feb. 1, 2025

Language: Английский

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A review in thermal management for advanced chip packaging from chip to heat sink

Microelectronics Reliability, Journal Year: 2025, Volume and Issue: 170, P. 115782 - 115782

Published: May 12, 2025

Language: Английский

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Optimizing interfacial thermal resistance in GaN/AlN heterostructures: The impact of AlN layer thickness

International Journal of Heat and Mass Transfer, Journal Year: 2024, Volume and Issue: 239, P. 126629 - 126629

Published: Dec. 27, 2024

Language: Английский

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