ACS Applied Materials & Interfaces,
Journal Year:
2023,
Volume and Issue:
15(23), P. 28536 - 28545
Published: June 2, 2023
Thermally
conductive
and
electrically
insulating
thermal
interface
materials
(TIMs)
are
highly
desired
for
electronic
cooling.
To
improve
heat
transfer
efficiency,
thermally
fillers
with
a
high
loading
content
have
been
incorporated
into
the
polymer-based
TIMs.
However,
this
is
usually
at
expense
of
interfacial
resistance
reduction
reliability.
In
study,
vertically
aligned
boron
nitride
nanosheet
films
(VBNFs)
prepared
by
scalable
microfluidic
spinning
process
template-assisted
chemical
vapor
deposition
conversion
method.
A
further
high-temperature
annealing
was
applied
to
achieve
crystallinity.
VBNFs
as
fabricate
TIMs
superior
through-plane
conductivity
6.4
W
m–1
K–1
low
modulus
2.2
MPa
BN
9.85
vol
%,
benefitting
from
well-aligned
vertical
sheet
structure
addition,
fabricated
present
high-volume
resistivity
breakdown
strength,
satisfying
electrical
insulation
demands.
The
contribute
an
outstanding
cooling
performance
in
dissipation
application
high-power
LEDs.
This
technology
fabrication
orientated
nanosheets
high-performance
pave
way
efficient
management
electronics.
Nano-Micro Letters,
Journal Year:
2023,
Volume and Issue:
15(1)
Published: Feb. 14, 2023
Hydrogen-bonded
organic
frameworks
(HOFs)
have
emerged
as
a
new
class
of
crystalline
porous
materials,
and
their
application
in
membrane
technology
needs
to
be
explored.
Herein,
for
the
first
time,
we
demonstrated
utilization
HOF-based
mixed-matrix
CO2
separation.
HOF-21,
unique
metallo-hydrogen-bonded
framework
material,
was
designed
processed
into
nanofillers
via
amine
modulator,
uniformly
dispersing
with
Pebax
polymer.
Featured
mix-bonded
framework,
HOF-21
possessed
moderate
pore
size
0.35
nm
displayed
excellent
stability
under
humid
feed
gas.
The
chemical
functions
multiple
binding
sites
continuous
hydrogen-bonded
network
jointly
facilitated
mass
transport
CO2.
resulting
exhibited
permeability
above
750
Barrer,
selectivity
~
40
CO2/CH4
60
CO2/N2,
surpassing
2008
Robeson
upper
bound.
This
work
enlarges
family
membranes
lays
foundation
HOF
development.
Chemistry of Materials,
Journal Year:
2023,
Volume and Issue:
35(13), P. 5193 - 5203
Published: June 21, 2023
Modern
electronic
equipment
with
high
integration
and
power
consumption
levels
urges
for
more
effective
thermal
interface
materials
(TIMs)
to
tackle
its
increasingly
severe
cooling
issues.
To
effectively
transfer
the
heat
generated
by
components
radiator,
TIM
is
supposed
have
a
through-plane
conductivity
(λ⊥);
however,
achieving
that
proved
devilishly
challenging.
Herein,
inspired
structure
of
natural
shell
nacre
based
on
construction
cis-polybutadiene
(BR)
vitrimer
network
reversible
B–O
bonds,
nacre-mimetic
microstructure
vertically
aligned
hexagonal
boron
nitride
(BN)
was
rationally
designed
fabricated.
Combining
hot-pressed
orientation
stacking-welding
method,
BN/BR
composite
(VAC)
obtained
longitudinal
slicing,
intense
verified
scanning
electron
microscopy
small-angle
X-ray
scattering.
As
result,
VAC
reached
an
unprecedented
λ⊥
14.1
W·m–1·K–1
as
BN
content
52
vol
%,
running
chip
temperature
greatly
reduced
compared
commercial
TIM.
Besides
superior
conductivity,
has
excellent
electrical
insulation
flame
resistance.
It
believed
simple
fabrication
extendibility
biomimetic
composites
pave
new
way
design
preparation
high-performance
TIMs.
Advanced Functional Materials,
Journal Year:
2023,
Volume and Issue:
34(10)
Published: Nov. 22, 2023
Abstract
Material
designs
for
wearable
sensors
are
increasingly
important
due
to
variable
application
scenarios
and
environmental
disturbances.
The
high
temperatures
pose
a
significant
challenge
the
performance
of
sensing
materials.
reasonable
anisotropic
structure
in
materials
is
recognized
as
promising
approach
address
this
challenge.
Precise
control
orientation
material
remains
difficult,
owing
entropy
effect.
In
work,
tunable
triboelectric
aerogel
via
an
situ
coupled
magnetic
alignment
protonation
reduction
strategy
demonstrated.
designed
with
fitting
degree
98%
can
effectively
suppress
electron
thermionic
emission,
which
enables
surface
charge
density
reach
75
µC
m
−2
at
300
°C.
Such
perfect
coordination
between
self‐powered
thermostability
innovates
multifunctional
design
temperatures,
allowing
aramid‐based
be
candidate
advanced
applications
military
aerospace
fields.
ACS Applied Materials & Interfaces,
Journal Year:
2023,
Volume and Issue:
15(36), P. 42900 - 42911
Published: Aug. 30, 2023
The
rapid
advancement
of
communication
technology
has
substantially
increased
the
demand
for
advanced
electronic
packaging
materials
with
high
thermal
conductivity
and
outstanding
electrical
insulation
properties.
In
this
study,
we
design
polyvinyl
alcohol/polydopamine-modified
boron
nitride
nanosheet
(PVA/BNNS@PDA)
nanocomposites
hierarchical
structures
by
combining
electrospinning,
vacuum
filtration
deposition,
hot
pressing.
modified
BNNS@PDA
improves
interaction
between
filler
polymer
matrix
while
reducing
interfacial
resistance,
resulting
in
superior
conductivity,
excellent
insulation,
perfect
flexibility.
PVA/BNNS@PDA
possess
an
ultrahigh
in-plane
16.6
W/(m·K)
at
35.54
wt
%
content.
Even
after
2000
folds,
do
not
undergo
any
crack,
showing
their
behavior.
Furthermore,
exhibit
a
volume
resistivity
above
1014
Ω·cm,
which
is
well
standard
insulating
materials.
Based
on
these
results,
work
provides
novel
method
to
produce
offering
new
perspective
management
ACS Nano,
Journal Year:
2023,
Volume and Issue:
17(19), P. 19323 - 19337
Published: Sept. 28, 2023
Insulating
thermally
conductive
polymer
composites
are
in
great
demand
integrated-circuit
packages,
for
efficient
heat
dissipation
and
to
alleviative
short-circuit
risk.
Herein,
the
continuous
oriented
hexagonal
boron
nitride
(h-BN)
frameworks
(o-BN@SiC)
were
prepared
via
self-assembly
situ
chemical
vapor
infiltration
(CVI)
interface
welding.
The
insulating
o-BN@SiC/epoxy
(o-BN@SiC/EP)
exhibited
enhanced
thermal
conductivity
benefited
from
CVI-SiC-welded
BN-BN
interface.
Further,
multiscale
simulation,
combining
first-principles
calculation,
Monte
Carlo
finite-element
was
performed
quantitatively
reveal
effect
of
welded
on
transfer
o-BN@SiC/EP
composites.
Phonon
transmission
solders
phonon-phonon
coupling
filler-solder
interfaces
interfacial
between
adjacent
h-BN
microplatelets,
resistance
dominant
decreased
only
3.83
nK·m2/W
400
nK·m2/W,
plunging
by
over
99%.
This
highly
weakened
greatly
improved
along
pathways
resulted
a
26%
enhancement
composites,
compared
with
physically
contacted
h-BN/EP
at
15
vol
%
h-BN.
systematic
simulation
broke
through
barrier
revealing
mechanism
nanoscale
macroscale,
which
provided
rational
cognition
about
fillers
SusMat,
Journal Year:
2024,
Volume and Issue:
unknown
Published: Sept. 23, 2024
Abstract
The
miniaturization,
integration,
and
high
data
throughput
of
electronic
chips
present
challenging
demands
on
thermal
management,
especially
concerning
heat
dissipation
at
interfaces,
which
is
a
fundamental
scientific
question
as
well
an
engineering
problem—a
death
problem
called
in
semiconductor
industry.
A
comprehensive
examination
interfacial
resistance
has
been
given
from
physics
perspective
2022
Review
Modern
Physics
.
Here,
we
provide
detailed
overview
materials
perspective,
focusing
the
optimization
structure
compositions
interface
(TIMs)
interact/contact
with
source
sink.
First,
discuss
impact
conductivity,
bond
line
thickness,
contact
TIMs.
Second,
it
pointed
out
that
there
are
two
major
routes
to
improve
transfer
through
interface.
One
reduce
TIM's
(
R
TIM
)
TIMs
strategies
like
incorporating
conductive
fillers,
enhancing
treatment
techniques.
other
c
by
improving
effective
contact,
strengthening
bonding,
utilizing
mass
gradient
alleviate
vibrational
mismatch
between
source/sink.
Finally,
such
challenges
theories,
potential
developments
sustainable
TIMs,
application
AI
design
also
explored.
Materials Horizons,
Journal Year:
2024,
Volume and Issue:
11(17), P. 4064 - 4074
Published: Jan. 1, 2024
In
the
pursuit
of
effective
thermal
management
for
electronic
devices,
it
is
crucial
to
develop
insulation
interface
materials
(TIMs)
that
exhibit
exceptional
through-plane
conductivity,
low
resistance,
and
minimal
compression
modulus.
Boron
nitride
(BN),
given
its
outstanding
conduction
properties,
has
garnered
significant
attention
as
a
potential
material
this
purpose.
However,
previously
reported
BN-based
composites
have
consistently
demonstrated
conductivity
below
10
W
m
