Design of efficient microstructured path by magnetic orientation boron nitride nanosheets/MnFe2O4 enabling waterborne polyurethane with high thermal conductivity and flame retardancy

Journal of Material Science and Technology, Journal Year: 2024, Volume and Issue: 209, P. 207 - 218

Published: May 27, 2024

Language: Английский

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Thermally Conductive Hexagonal Boron Nitride/Polymer Composites for Efficient Heat Transport

Advanced Functional Materials, Journal Year: 2024, Volume and Issue: 34(46)

Published: July 4, 2024

Abstract Commercial thermally conductive dielectric materials used in electronic packaging typically exhibit thermal conductivities ( κ ) ranging from 0.8 to 4.2 W m −1 K . Hexagonal boron nitride (h‐BN) flakes are promising for the management of next‐generation electronics. These electrically insulating yet conducting h‐BN can be incorporated as fillers impart high polymer‐based composites. A cellulose‐based composite embedded with few‐layer (FLh‐BN) flakes, achieving a ≈ 21.7 , prepared using cost‐effective and scalable procedure is demonstrated. This value >5 times higher than observed composites bulk (Bh‐BN, 4.5 ), indicating benefits superior FLh‐BN on polymer When applied paste interface material (TIM), reduce maximum temperature T max by 24.5 °C heating pad at power density h 2.48 cm −2 compared Bh‐BN same loading. The results provide an effective approach improve pastes TIMs demonstrate their viability heat dissipation integrated circuits (ICs) high‐power devices.

Language: Английский

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Highly Thermally Conductive and Flame-Retardant Waterborne Polyurethane Composites with 3D BNNS Bridging Structures via Magnetic Field Assistance

Nano-Micro Letters, Journal Year: 2025, Volume and Issue: 17(1)

Published: Feb. 7, 2025

Abstract The microstructure design for thermal conduction pathways in polymeric electrical encapsulation materials is essential to meet the stringent requirements efficient management and runaway safety modern electronic devices. Hence, a composite with three-dimensional network (Ho/U-BNNS/WPU) developed by simultaneously incorporating magnetically modified boron nitride nanosheets (M@BNNS) non-magnetic organo-grafted BNNS (U-BNNS) into waterborne polyurethane (WPU) synchronous molding under horizontal magnetic field. results indicate that continuous in-plane formed M@BNNS aligned along field direction, combined bridging structure established U-BNNS, enable Ho/U-BNNS/WPU exhibit exceptional ( λ // ) through-plane conductivities ⊥ ). In particular, addition of 30 wt% 5 composites reach 11.47 2.88 W m −1 K , respectively, which representing 194.2% improvement compared single orientation M@BNNS. Meanwhile, exhibits distinguished capabilities as interface LED chips. also demonstrate excellent flame retardancy, peak heat release total reduced 58.9% 36.9%, WPU. Thus, this work offers new insights thermally conductive structural flame-retardant systems polymer composites, presenting broad application potential packaging fields.

Language: Английский

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Structure, properties and applications of multi-functional thermally conductive polymer composites

Journal of Material Science and Technology, Journal Year: 2024, Volume and Issue: 200, P. 141 - 161

Published: April 3, 2024

Language: Английский

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Mussel-Inspired Polymer-Based Composites for Efficient Thermal Management in Dry and Underwater Environments

ACS Nano, Journal Year: 2024, Volume and Issue: 18(32), P. 21399 - 21410

Published: Aug. 2, 2024

To address the escalating power consumption of processors in data centers and growing emphasis on environmental sustainability, prospective shift from traditional air-cooling to immersion liquid cooling necessitates multiple functional integrations polymer-based thermal conductive materials. Here, drawing inspiration mussels, we showed a copolymer, poly(dimethylsiloxane-co-dopamine methacrylate) (PDMS-DMA), with variety reversible molecular interactions simply combined metal (EGaIn) can yield flexible, waterproof, electrically insulating composite. The obtained PDMS-DMA/EGaIn composites demonstrate harmonious blend attributes, including low modulus (75.8 kPa), high conductivity 6.9 W m–1 K–1, rapid room-temperature self-healing capabilities, capable complete repair within 20 min, even under water. Based its water resistance properties, emerges as promising candidate for efficient stable heat transfer both air underwater management. Consequently, this water-resistant composite holds significance application protective layers future systems.

Language: Английский

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Thermal interface materials: From fundamental research to applications

SusMat, Journal Year: 2024, Volume and Issue: unknown

Published: Sept. 23, 2024

Abstract The miniaturization, integration, and high data throughput of electronic chips present challenging demands on thermal management, especially concerning heat dissipation at interfaces, which is a fundamental scientific question as well an engineering problem—a death problem called in semiconductor industry. A comprehensive examination interfacial resistance has been given from physics perspective 2022 Review Modern Physics . Here, we provide detailed overview materials perspective, focusing the optimization structure compositions interface (TIMs) interact/contact with source sink. First, discuss impact conductivity, bond line thickness, contact TIMs. Second, it pointed out that there are two major routes to improve transfer through interface. One reduce TIM's ( R TIM ) TIMs strategies like incorporating conductive fillers, enhancing treatment techniques. other c by improving effective contact, strengthening bonding, utilizing mass gradient alleviate vibrational mismatch between source/sink. Finally, such challenges theories, potential developments sustainable TIMs, application AI design also explored.

Language: Английский

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Exploring Trade-offs in Thermal Interface Materials: The Impact of Polymer-Filler Interfaces on Thermal Conductivity and Thixotropy

Chinese Journal of Polymer Science, Journal Year: 2024, Volume and Issue: 42(7), P. 916 - 925

Published: March 18, 2024

Language: Английский

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Significantly anisotropic thermal conductivity improvement of PEEK composites with EMI shielding effectiveness

Composites Communications, Journal Year: 2025, Volume and Issue: unknown, P. 102282 - 102282

Published: Jan. 1, 2025

Language: Английский

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Vertical 3D printing of rGO/CNTs arrays for thermal interface materials with in-situ local temperature monitoring function

Chemical Engineering Journal, Journal Year: 2024, Volume and Issue: 496, P. 153643 - 153643

Published: July 3, 2024

Language: Английский

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Highly oriented BN-based TIMs with high through-plane thermal conductivity and low compression modulus

Materials Horizons, Journal Year: 2024, Volume and Issue: 11(17), P. 4064 - 4074

Published: Jan. 1, 2024

In the pursuit of effective thermal management for electronic devices, it is crucial to develop insulation interface materials (TIMs) that exhibit exceptional through-plane conductivity, low resistance, and minimal compression modulus. Boron nitride (BN), given its outstanding conduction properties, has garnered significant attention as a potential material this purpose. However, previously reported BN-based composites have consistently demonstrated conductivity below 10 W m

Language: Английский

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