Small,
Journal Year:
2025,
Volume and Issue:
unknown
Published: April 21, 2025
Abstract
In
the
microelectronics
era,
electromagnetic
radiation
and
heat
accumulation
in
electronic
devices
are
urgent
challenges
requiring
solutions,
particularly
through
use
of
structure‐function
integrated
lightweight
materials
for
interference
(EMI)
shielding
thermal
management.
Hierarchically
structured
polyether‐ether‐ketone‐based
composites
prepared
this
study
by
situ
deposition
dip
coating
using
a
simple
scalable
method.
Magnetic
cobalt
nanoparticles
derived
from
magnetic
metal–organic
frameworks
deposited
on
carbon
fiber
felt
featuring
macroscopic
continuous
conductive
network.
Next,
hybrid
slurry
is
applied
to
connect
isolated
fibers,
which
bridge
gaps
create
new
electron
phonon
transport
channels,
increasing
conductivity
(23.43
W
m
−1
K
plane,
4.84
plane)
efficient
dissipation.
Owing
stable
3D
crosslinked
network
with
high
electrical
(13
608
S
),
composite
offers
ultra‐high
EMI
X‐band
(101.64
dB
stability
extreme
environments),
excellent
Joule
heating
performance
(220
°C
at
4
V),
photothermal
conversion
(94
500
mW
cm
−2
).
This
multifunctional
material
has
great
application
prospects
precision
equipment.
Advanced Materials,
Journal Year:
2024,
Volume and Issue:
unknown
Published: July 6, 2024
Flexible
and
highly
thermally
conductive
materials
with
consistent
thermal
conductivity
(λ)
during
large
deformation
are
urgently
required
to
address
the
heat
accumulation
in
flexible
electronics.
In
this
study,
spring-like
conduction
pathways
of
silver
nanowire
(S-AgNW)
fabricated
by
3D
printing
compounded
polydimethylsiloxane
(PDMS)
prepare
S-AgNW/PDMS
composites
excellent
λ
deformation.
The
exhibit
a
7.63
W
m
ACS Nano,
Journal Year:
2024,
Volume and Issue:
18(5), P. 3851 - 3870
Published: Jan. 24, 2024
Polymer
nanocomposites
combine
the
merits
of
polymer
matrices
and
unusual
effects
nanoscale
reinforcements
have
been
recognized
as
important
members
material
family.
Being
a
fundamental
property,
thermal
conductivity
directly
affects
molding
processing
materials
well
design
performance
devices
systems.
used
in
numerous
industrial
fields;
thus,
high
demands
are
placed
on
feature
nanocomposites.
In
this
Perspective,
we
first
provide
roadmaps
for
development
with
isotropic,
in-plane,
through-plane
conductivities,
demonstrating
great
effect
enhancement
Then
significance
different
application
fields,
including
wearable
electronics,
interface
materials,
battery
management,
dielectric
capacitors,
electrical
equipment,
solar
energy
storage,
biomedical
applications,
carbon
dioxide
capture,
radiative
cooling,
highlighted.
future
research,
should
continue
to
focus
methods
that
can
further
improve
On
other
hand,
pay
more
attention
synergistic
improvement
properties
Emerging
be
based
application-oriented
research.
Heliyon,
Journal Year:
2024,
Volume and Issue:
10(3), P. e25381 - e25381
Published: Feb. 1, 2024
The
internet
of
things
and
growing
demand
for
smaller
more
advanced
devices
has
created
the
problem
high
heat
production
in
electronic
equipment,
which
greatly
reduces
work
performance
life
instruments.
Thermal
interface
material
(TIM)
is
placed
between
generating
micro-chip
dissipater
to
conduct
all
produced
sink.
development
suitable
TIM
with
excellent
thermal
conductivity
(TC)
both
in-plane
through-plane
directions
a
very
important
need
at
present.
For
efficient
management,
polymer
composites
are
potential
candidates.
But
general,
their
low
compared
that
metals.
filler
integration
into
matrix
one
two
approaches
used
increase
also
easy
scale
up
industrial
production.
Another
way
achieve
this
change
structure
chains,
fall
out
scope
work.
In
review,
considering
first
approach,
authors
have
summarized
recent
developments
many
types
fillers
different
scenarios
by
providing
multiple
cases
successful
strategies
improve
(TPTC)
(k⊥).
better
understanding
TC,
comprehensive
background
presented.
Several
methods
effective
(out-plane)
theoretical
models
calculation
TC
discussed.
end,
it
given
detailed
conclusion
provides
drawbacks
some
fillers,
significant
routes
recommended
other
researchers
build
thermally
conductive
composites,
future
aspects
along
direction
so
can
get
guideline
design
an
polymer-based
material.
Polymer Degradation and Stability,
Journal Year:
2024,
Volume and Issue:
228, P. 110902 - 110902
Published: June 25, 2024
Fused
Deposition
Modelling
(FDM),
a
prevalent
additive
manufacturing
technique
utilising
polymeric
materials,
facilitates
intricate
geometric
customisation
and
rapid
prototyping.
The
ongoing
development
of
FDM
technology
emphasises
the
importance
thermal
characteristics
FDM-printed
which
are
essential
for
various
applications,
including
aerospace
biomedical
engineering.
properties
covering
wide
range
thermoplastic
polymers
composites,
were
examined
in
this
review.
Despite
versatility
technology,
challenges
persist
3D
printed
parts,
manifesting
as
anisotropy,
voids,
sub-optimal
conductivity,
thereby
impeding
performance.
Achieving
precise
control
over
printing
parameters
such
nozzle
temperature,
layer
height,
speed
is
pivotal
optimising
properties.
Additionally,
controlled
treatments,
like
annealing,
offer
avenues
manipulating
crystalline
structure
components
to
enhance
conductivity.
By
elucidating
effects
reinforcements,
article
aims
provide
insights
into
potential
enhancements
adjustments
developing
thermally
resistant
FDM-based
materials.
Materials Horizons,
Journal Year:
2024,
Volume and Issue:
11(17), P. 4064 - 4074
Published: Jan. 1, 2024
In
the
pursuit
of
effective
thermal
management
for
electronic
devices,
it
is
crucial
to
develop
insulation
interface
materials
(TIMs)
that
exhibit
exceptional
through-plane
conductivity,
low
resistance,
and
minimal
compression
modulus.
Boron
nitride
(BN),
given
its
outstanding
conduction
properties,
has
garnered
significant
attention
as
a
potential
material
this
purpose.
However,
previously
reported
BN-based
composites
have
consistently
demonstrated
conductivity
below
10
W
m
ACS Applied Polymer Materials,
Journal Year:
2024,
Volume and Issue:
6(10), P. 6057 - 6067
Published: May 9, 2024
The
thermal
management
fields
are
witnessing
growing
interest
in
flexible
polymer
composites
that
exhibit
high
conductivity
and
effective
electromagnetic
interference
(EMI)
shielding.
Anisotropic
thermally
conductive
thermoplastic
polyurethane
(TPU)
composite
films
with
EMI
shielding
performance
were
prepared
by
solution
blending
hot-pressing
through
an
enhanced
orientation
of
pitch-based
carbon
fibers
the
in-plane
direction.
influence
film
thickness
filler
content
on
was
systematically
investigated.
TPU
presented
15.11
W/(m
K)
effectiveness
above
29
dB
at
8.2–12.5
GHz
0.2
mm
30
vol
%.
Furthermore,
laminated
fabricated
a
layer-by-layer
stacking
followed
(namely,
hot-pressing)
different
number
layers.
increased
due
to
reinforcement
fiber,
highest
being
17.69
for
ten-layer
films.
In
addition,
these
exhibited
good
(all
dB),
service
stability,
mechanical
properties.
This
work
paves
way
fabricating
multifunctional
composites,
enabling
advancements
ACS Applied Materials & Interfaces,
Journal Year:
2023,
Volume and Issue:
15(46), P. 54027 - 54038
Published: Nov. 8, 2023
Modern
highly
integrated
microelectronic
devices
are
unable
to
dissipate
heat
over
time,
which
greatly
affects
the
operating
efficiency
and
service
life
of
electronic
equipment.
Constructing
high-thermal-conductivity
composites
with
3D
network
structures
is
a
hot
research
topic.
In
this
article,
carbon
fiber
felt
(CFF)
was
prepared
by
airflow
netting
forming
technology
needle
punching
combined
stepped
treatment.
Then,
carbon-coated
(C@CFF)
three-dimensional
structure
constructed
in
situ
high-temperature
chemical
vapor
deposition
(CVD).
Finally,
treatment
used
improve
degree
crystallinity
C@CFF
further
enhance
its
graphitization.
The
epoxy
(EP)
were
simple
vacuum
infiltration-molding
curing.
test
results
showed
that
in-plane
thermal
conductivity
(K∥)
through-plane
(K⊥)
EP/C@CFF-2300
°C
could
reach
up
13.08
2.78
W/mK,
respectively,
where
deposited
content
11.76
vol
%.
enhancement
(TCE)
improved
6440
808%
compared
those
pure
EP
EP/CFF,
respectively.
provides
an
improvement
for
through-plane.
Infrared
imaging
excellent
management
properties
composites.
owned
AC
0.035
S/cm
at
10
kHz,
Lorentz-Drude-type
negative
permittivity
behaviors
observed
tested
frequency
region.
CFF
thermally
conductive
above
method
have
broad
application
prospect
field
advanced
electromagnetics.
