Cited by Phase-change Composite Elastomers for Efficient Thermal Management at Contact Interface

Patterned liquid metal embedded in brush-shaped polymers for dynamic thermal management DOI

Qingxia He,

Mengmeng Qin, Heng Zhang

et al.

Materials Horizons, Journal Year: 2023, Volume and Issue: 11(2), P. 531 - 544

Published: Nov. 10, 2023

A series of patterned LM pathways are embedded in brush-shaped polymers, by combining vertically oriented graphene aerogels (VGAs) to fabricate soft elasticity thermally conductive composites for dynamic thermal management.

Language: Английский

Citations

Adjustable boron nitride segregated framework in epoxy resin for high performance thermal management and flame retardant applications DOI

Wei Wang, Yuan Liu, Qi Wang

et al.

Composites Science and Technology, Journal Year: 2023, Volume and Issue: 242, P. 110161 - 110161

Published: July 14, 2023

Language: Английский

Citations

Structure, properties and applications of multi-functional thermally conductive polymer composites DOI

Yali Dong, Huitao Yu, Yiyu Feng

et al.

Journal of Material Science and Technology, Journal Year: 2024, Volume and Issue: 200, P. 141 - 161

Published: April 3, 2024

Language: Английский

Citations

Simultaneous Reduction of Bulk and Contact Thermal Resistance in High‐Loading Thermal Interface Materials Using Self‐Assembled Monolayers DOI

Xiu He,

Xirui Liu,

Jiajing Huang

et al.

Advanced Functional Materials, Journal Year: 2024, Volume and Issue: 34(37)

Published: April 2, 2024

Abstract Thermal interface materials (TIMs) play a pivotal role in the transfer of heat from high‐temperature sources, such as CPUs, to sinks power electronics. The effectiveness grease‐type TIMs is determined by their effective thermal impedance ( R EFF ), which hinges on optimizing both specific bulk B ) and contact C resistances. Achieving concurrent optimization these resistances poses significant challenge, especially high filler loading TIMs, typically above 76 vol%. This research leverages engineering through Self‐Assembled Monolayers (SAMs) address this challenge. A substantial decrease realized 0.169 K cm 2 W −1 , tenfold enhancement compared non‐SAM treated exhibit values 2.265 . leap performance primarily ascribed reduced surface energy SAM Al O 3 leading lower particle‐to‐particle Van der Waals forces, thereby improving particle dispersion strengthening interfacial bonds. Furthermore, longer carbon chains SAMs result increased yet due chains' capacity for enhanced absorption molecular entanglement. investigation underscores significance shorter‐chain fine‐tuning resistance, highlighting crucial architecture design advanced TIMs.

Language: Английский

Citations

Thermal interface materials: From fundamental research to applications DOI

Baojie Wei,

Wenmei Luo,

Jianying Du

et al.

SusMat, Journal Year: 2024, Volume and Issue: unknown

Published: Sept. 23, 2024

Abstract The miniaturization, integration, and high data throughput of electronic chips present challenging demands on thermal management, especially concerning heat dissipation at interfaces, which is a fundamental scientific question as well an engineering problem—a death problem called in semiconductor industry. A comprehensive examination interfacial resistance has been given from physics perspective 2022 Review Modern Physics . Here, we provide detailed overview materials perspective, focusing the optimization structure compositions interface (TIMs) interact/contact with source sink. First, discuss impact conductivity, bond line thickness, contact TIMs. Second, it pointed out that there are two major routes to improve transfer through interface. One reduce TIM's ( R TIM ) TIMs strategies like incorporating conductive fillers, enhancing treatment techniques. other c by improving effective contact, strengthening bonding, utilizing mass gradient alleviate vibrational mismatch between source/sink. Finally, such challenges theories, potential developments sustainable TIMs, application AI design also explored.

Language: Английский

Citations

Self-healing polyurethane elastomers with dynamic crosslinked networks for complex structure 3D printing DOI

Yijie Liu, Jichi Zhang, Yuan Ji

et al.

Chemical Engineering Journal, Journal Year: 2025, Volume and Issue: unknown, P. 160193 - 160193

Published: Feb. 1, 2025

Language: Английский

Citations

Soft and Damping Thermal Interface Materials with Honeycomb‐Board‐Mimetic Filler Network for Electronic Heat Dissipation DOI

Wenjie Liu, Yijie Liu,

Shujing Zhong

et al.

Small, Journal Year: 2024, Volume and Issue: 20(35)

Published: April 28, 2024

Abstract High‐power‐density electronic devices under vibrations call for soft and damping thermal interface materials (TIMs) efficient heat dissipation. However, integrating low hardness, high damping, superior transfer capability into one TIM is highly challenging. Herein, soft, thermally conductive TIMs are designed prepared by constructing a honeycomb‐board‐mimetic boron nitride nanosheet (BNNS) network in dynamic polyimine via one‐step horizontal centrifugal casting. The unique filler makes the perform through‐plane conductivity (> 7.69 W m −1 K ) uniform process. Meanwhile, hierarchical bonding of endows with compressive strength (2.16 MPa at 20% strain) excellent performance (tan δ > ≈0.3 10 −2 –10 2 Hz). resulting also exhibit electrical insulation remarkable recycling ability. Compared commercial ones, provide better dissipation (4.1 °C) high‐power 5G base station less temperature fluctuation (1.8 an automotive insulated gate bipolar transistor (IGBT) vibrations. This rational design offers viable approach to prepare effective high‐power‐density

Language: Английский

Citations

Highly oriented BN-based TIMs with high through-plane thermal conductivity and low compression modulus DOI

Rongjie Yang,

Yandong Wang,

Zhenbang Zhang

et al.

Materials Horizons, Journal Year: 2024, Volume and Issue: 11(17), P. 4064 - 4074

Published: Jan. 1, 2024

In the pursuit of effective thermal management for electronic devices, it is crucial to develop insulation interface materials (TIMs) that exhibit exceptional through-plane conductivity, low resistance, and minimal compression modulus. Boron nitride (BN), given its outstanding conduction properties, has garnered significant attention as a potential material this purpose. However, previously reported BN-based composites have consistently demonstrated conductivity below 10 W m

Language: Английский

Citations

Grafted Alkene Chains: Triggers for Defeating Contact Thermal Resistance in Composite Elastomers DOI

Min Yang, Yunsong Pang, Junhong Li

et al.

Small, Journal Year: 2023, Volume and Issue: 20(2)

Published: Sept. 1, 2023

Abstract The pursuit of enhancing the heat transfer performance composite elastomers as thermal interface materials (TIMs) is a compelling and timely endeavor, given formidable challenges posed by interfacial transport in domains energy science, electronic technology, etc. Despite efficacy phase change (PCMs) elastomers’ compatibility, thereby reducing contact resistance for improvement, their leakage post‐transition has impeded widespread adoption this approach. Herein, strategy proposed developing solid‐solid elastomer grafting alkene chains onto crosslink network to eliminate possibility leakage. A series characterization suggest that resulting material possesses self‐adjusting compatibility feature help reduce facilitating. investigations on adhesion strength surface reveal presence amorphous grafted alkane at facilitates easier absorption contacting solid surface, intermolecular interactions promote across‐boundary transfer. By integrating these findings with evaluation using real test vehicle, valuable insights are gained design elastomers, establishing suitability TIMs relevant fields.

Language: Английский

Citations

A robust bio-based polyurethane employed as surgical suture with help to promote skin wound healing DOI

Junjie Wang,

Zhixiu Liu,

Haojie Qiu

et al.

Biomaterials Advances, Journal Year: 2024, Volume and Issue: 166, P. 214048 - 214048

Published: Sept. 19, 2024

Language: Английский

Citations